STRENGTHENING OF ALUMINIUM-COPPER ALLOYS THIN FILMS

  • DRAISSIA M LM2S, Département de Physique, Faculté des Sciences, Université Badji-Mokhtar, BP12 Annaba 23000, Algérie.
  • DEBILI M.Y LM2S, Département de Physique, Faculté des Sciences, Université Badji-Mokhtar, BP12 Annaba 23000, Algérie.

Résumé

We have modelled, from characteristics of aluminium and its alloying elements, the microhardness evolution of sputtered on glass slides aluminium-copper alloys deposits. This one regularly increases with the copper concentration from 1300 MPa for sputtered pure aluminium, reaches a maximum of about 8500 MPa corresponding for 49 at.%Cu and then decreases till sputtered pure copper estimated about 2300 MPa. Such films, with a hardness higher than for corresponding conventional alloys, can be used as hard coatings for these alloys This phenomenon of significant mechanical hardening of aluminium by the means of transition elements is attributed essentially to a simultaneous effect of solid solution and grain size refinement due to the difference in the size of the atoms of the solvent and the solute.

Publiée
2006-01-01
Comment citer
M, D., & M.Y, D. (2006). STRENGTHENING OF ALUMINIUM-COPPER ALLOYS THIN FILMS. Annales Des Sciences Et Technologie, 1(1), 3. Consulté à l’adresse https://journals.univ-ouargla.dz/index.php/AST/article/view/175
Numéro
Vol. 1 No 1 (2006): volume 1 numéro 1 2006
Rubrique
Articles